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Tag Archives: STMicro

IoT vs. Traditional Embedded for Analog, Low Power and Security

In Part III, technology leaders from STMicro, Atmel, Mouser, Synopsys, Movea, and ARM, define the big challenges in IoT – mixed signal, low power and security.

Will the Internet-of-Things (IoT) bring new analog integration, low power and security challenges to traditional SoC and embedded designs? To answer these questions, System Design Engineering sat down Bernard Kasser, Director Security R&D, Advanced System Technology, STMicroelectronic; Bob Martin, Senior Manager Microcontroller Group Central Applications, Atmel; Kevin Parmenter, Director of Technical Resources, Mouser; Steve Smith, Senior Director of Marketing, AMS Group, Synopsys; Cyrille Soubeyrat, VP of Engineering at Movea; and Diya Soubra, CPU Product Marketing Manager, ARM. What follows are excerpts from that discussion. – JB

Are Semiconductor Fabs and EDA-IP Ready for FD-SOI?

Recent announcements by the semiconductor foundry and chip design tool industries confirm the growing viability of Silicon-on-Insulator technology.

The recent announcement that Samsung Electronics would source SOI manufacturing is welcome news to the chip community. But does this additional manufacturing capability mean that EDA and IP tool vendors will give greater support to the SoI technology, as Peter Clark suggests in a recent article? Does the gain of the Samsung foundry suggest a loss of support from the GLOBALFOUNDRIES? Let’s focus on the first question.

Read the complete post on the Chipestimate.com IP-Insider blog.